Exploring the Feasibility of Fabricating Micron-Scale Components Using Microcontact Printing LDRD Final Report

MYERS, RAMONA L. ; RITCHEY, M. BARRY ; STOKES, ROBERT N. ; CASIAS, ADRIAN L. ; ADAMS, DAVID P. ; OLIVER, ANDREW D. ; EMERSON, JOHN A.

Sandia National Laboratories

关键词: Gold;    Miniaturization;    Microelectronics;    Printed Circuits;    42 Engineering;   

DOI  :  10.2172/820892
RP-ID  :  SAND2003-1964
RP-ID  :  AC04-94AL85000
RP-ID  :  820892

美国|英语

来源: UNT Digital Library

【 摘 要 】

Many microfabrication techniques are being developed for applications in microelectronics, microsensors, and micro-optics. Since the advent of microcomponents, designers have been forced to modify their designs to include limitations of current technology, such as the inability to make three-dimensional structures and the need for piece-part assembly. Many groups have successfully transferred a wide variety of patterns to both two-dimensional and three-dimensional substrates using microcontact printing. Microcontact printing is a technique in which a self-assembled monolayer (SAM) is patterned onto a substrate by transfer printing. The patterned layer can act as an etch resist or a foundation upon which to build new types of microstructures. We created a gold pattern with features as small as 1.2 {micro}m using microcontact printing and subsequent processing. This approach looks promising for constructing single-level structures such as microelectrode arrays and sensors. It can be a viable technique for creating three-dimensional structures such as microcoils and microsprings if the right equipment is available to achieve proper alignment, and if a means is available to connect the final parts to other components in subsequent assembly operations. Microcontact printing provides a wide variety of new opportunities in the fabrication of microcomponents, and increases the options of designers.