Advanced modeling and simulation to design and manufacture high performance and reliable advanced microelectronics and microsystems.

Nettleship, Ian (University of Pittsburgh, Pittsburgh, PA) ; Hinklin, Thomas ; Holcomb, David Joseph ; Tandon, Rajan ; Arguello, Jose Guadalupe, Jr. (, ; .) ; Dempsey, James Franklin ; Ewsuk, Kevin Gregory ; Neilsen, Michael K. ; Lanagan, Michael (Pennsylvania Sta

关键词: COMPUTER-AIDED DESIGN;    MICROELECTRONICS;    PERFORMANCE;    COMPUTERIZED SIMULATION;    MANUFACTURING;    MATHEMATICAL MODELS Integrated circuits-Materials-Thermomechanical properties.;    Materials.;    Simulation and Modeling;    Microelectronics-Materials-R;   

DOI  :  10.2172/913216
RP-ID  :  SAND2007-4298
PID  :  OSTI ID: 913216
Others  :  TRN: US200802%%383

学科分类：工程和技术（综合）

美国|英语

来源: SciTech Connect

【 摘 要 】

An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The team's efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in ''real systems'', including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.