Electromigration in Bi-crystal pure Sn solder joints: Elucidating the role of grain orientation

JOURNAL OF ALLOYS AND COMPOUNDS

卷:818

Article

Kelly, Marion Branch¹  Niverty, Sridhar¹  Chawla, Nikhilesh¹ 

[1] Arizona State Univ, Ctr 4D Mat Sci, Interdisciplinary Sci & Technol Bldg 4, Tempe, AZ 85287 USA

关键词: Intermetallics;    Semiconductors;    Anisotropy;    Diffusion;    Crystal structure;   

DOI  :  10.1016/j.jallcom.2019.152918

来源: Elsevier

【 摘 要 】

Intermetallic compound (IMC) and void growth are electromigration (EM) damage mechanisms that are controlled by the anisotropic diffusion of Cu in beta-tetragonal Sn solder joints. Single crystal fast diffusion, slow diffusion, and bicrystal solder joints were fabricated and tested under thermal aging and EM conditions to investigate the effect of grain orientation on microstructure evolution including IMC growth, void growth and grain structure. Sample and testing geometry ensured there were no effects from current crowding or joule heating so that crystallographic effects could be isolated. Microstructure characterization by scanning electron microscope (SEM), electron backscatter diffraction (EBSD) and X-ray microtomography revealed interface-nucleated and bulk-nucleated IMC growth, particle stimulated nucleation (PSN) of recrystallized grains, and two unique voiding behaviors, void faceting and void burrowing. The relationship between these features and beta-Sn grain orientation and implications for EM damage mitigation are discussed. (C) 2019 Elsevier B.V. All rights reserved.

【 授权许可】

Free