Damping characteristics of Sn-3Ag-0.5Cu and Sn-37Pb solders studied by dynamic mechanical analysis

SCRIPTA MATERIALIA

卷:63

Article

Chang, S. H.²  Wu, S. K.¹ 

[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 106, Taiwan

[2] Natl Ilan Univ, Dept Chem & Mat Engn, Ilan 260, Taiwan

关键词: Soldering;    Dynamic mechanical analysis;    Metal and alloys;    Damping;   

DOI  :  10.1016/j.scriptamat.2010.07.004

来源: Elsevier

【 摘 要 】

Sn-37Pb solder and pure Sn metal exhibit a conspicuous high-temperature damping background (HTDB) in low-frequency internal friction Q(-1) (T) curves with activation energies, H, of HTDB being 0.43 and 0.98 eV, respectively. Sn-37Pb solder has a lamellar eutectic structure that can promote the diffusion-assisted climb of dislocations, resulting in lower H. Sn-3Ag-0.5Cu solder shows no HTDB in Q(-1) (T) curves since the formation of Cu6Sn5 and Ag3Sn intermetallics in the eutectic network band can impede dislocation motion. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

【 授权许可】

Free