Low-frequency damping properties of eutectic Sn-Bi and In-Sn solders

SCRIPTA MATERIALIA

卷:64

Article

Chang, S. H.²  Wu, S. K.¹ 

[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 106, Taiwan

[2] Natl Ilan Univ, Dept Chem & Mat Engn, Ilan 260, Taiwan

关键词: Soldering;    Dynamic mechanical analysis;    Metal and alloys;    Damping;   

DOI  :  10.1016/j.scriptamat.2010.12.035

来源: Elsevier

【 摘 要 】

Eutectic Sn-Bi and In-Sn solders possess much higher damping capacities than Sn-Ag-Cu solders at temperatures above room temperature. The strain amplitude dependence of damping capacities in Sn-Bi solder determined at room temperature is comparable to that of Mg alloys measured at the same temperature. Sn-Bi and In-Sn solders both exhibit conspicuous high-temperature damping backgrounds, with activation energies of 0.77 and 0.27 eV, respectively. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

【 授权许可】

Free