Printed wiring board fabrication and lead elimination via single-bath electrodeposition | |
Meltzer, M P ; Steffani, C P | |
Lawrence Livermore National Laboratory | |
关键词: Soldering; 99 General And Miscellaneous//Mathematics, Computing, And Information Science; Electroplating; Personnel; Plating; | |
DOI : 10.2172/15005413 RP-ID : UCRL-ID-142542 RP-ID : W-7405-ENG-48 RP-ID : 15005413 |
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美国|英语 | |
来源: UNT Digital Library | |
【 摘 要 】
Printed wiring board (PWB) fabrication, an operation performed both at LLNL and throughout the electronics industry, generates considerable quantities of hazardous waste, notably lead-bearing materials used for soldering, tinning, and finish coating the circuits of the board. Hot-air solder leveling (HASL), the most common method of finishing is one of the main sources of hazardous lead-bearing wastes in traditional PWB manufacturing. The development of a safer finishing method will lead to employee health and environmental benefits. In addition, there is a production advantage to eliminating HASL, for it provides a fairly uneven surface that is problematic for mounting very small components. In this project, we developed ''single-bath electroplating'' as a potential HASL replacement technology for many applications. Single-bath electroplating involves alternating deposition of one or the other metal component of a bimetal bath, through control of plating potential and mass transport. It employs a nickel layer as both etch resist and finish coat and has the potential for lowering environmental and human-health risks associated with PWB manufacture--while at the same time reconfiguring the process for greater efficiency and profitability.
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15005413.pdf | 243KB | download |