Improved mechanical and thermomechanical properties of alumina substrate via iron doping

SCRIPTA MATERIALIA

卷:68

Article

Made, Riko. I.¹  Phua, Eric Jian Rong^1,2  Pramana, Stevin Snellius^1,3  Wong, Chee Cheong¹  Chen, Zhong¹  Tok, Alfred Iing Yoong¹  Gan, Chee Lip¹ 

[1] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

[2] ASTAR, Inst Microelect, Singapore 117685, Singapore

[3] Nanyang Technol Univ, Facil Anal Characterizat Testing & Simulat, Singapore 639798, Singapore

关键词: Ceramics;    High temperature;    Harsh environment;    Electronics packaging;    High pressure;   

DOI  :  10.1016/j.scriptamat.2013.02.032

来源: Elsevier

【 摘 要 】

We present a method to improve the overall properties of sintered alumina substrate via iron doping that has a higher fracture toughness, lower thermal conductivity, lower thermal expansion coefficient and comparable dielectric constant than pure alumina. Such properties are beneficial for harsh environment electronic packages. X-ray and electron probe microanalyses concluded that toughening is likely caused by multiple phase strengthening and ruled out crack bridging or grain boundary strengthening. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

【 授权许可】

Free