Transient liquid phase Ag-based solder technology for high-temperature packaging applications

JOURNAL OF ALLOYS AND COMPOUNDS

卷:587

Article

Sharif, Ahmed¹  Gan, Chee Lip²  Chen, Zhong² 

[1] Bangladesh Univ Engn & Technol, Dept Mat & Met Engn, Dhaka 1000, Bangladesh

[2] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

关键词: Harsh environment;    Microelectronics packaging;    Transient-liquid-phase;    High-temperature reliability;    Intermetallic compounds;   

DOI  :  10.1016/j.jallcom.2013.10.204

来源: Elsevier

【 摘 要 】

A lead-free Ag-based soldering technique through transient-liquid-phase (TLP) bonding is proposed in this study for high-temperature microelectronic packaging applications. The solder paste, which contained Ag and Sn powders with a no-clean flux, was used to join Cu substrates. The setup was bonded at 250 degrees C for 10 minutes. The study focuses on mechanical and microstructural characterizations of the joints. The shear strength measured at 250 degrees C shows good high temperature performance of the joint. The effects of Ag and Sn contents on mechanical, electrical and thermal properties of sintered bulk Ag-Sn samples were also investigated independently. The results demonstrate that the Ag-Sn TLP bonding is an effective interconnection method for harsh environment electronic packaging. (C) 2013 Elsevier B.V. All rights reserved.

【 授权许可】

Free