Effect of grain boundary engineering on microstructural stability during annealing

SCRIPTA MATERIALIA

卷:61

Article

Schlegel, Scott M.¹  Hopkins, Sharla¹  Frary, Megan¹ 

[1] Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA

关键词: Grain boundary engineering;    Abnormal grain growth;    Grain boundary connectivity;    Copper;    Texture;   

DOI  :  10.1016/j.scriptamat.2009.03.013

来源: Elsevier

【 摘 要 】

Grain boundary engineering, which increases the special boundary fraction, may improve microstructural stability during annealing. Different processing routes are undertaken to establish the effectiveness of each and to better understand which microstructural features determine the resulting stability. We find that multiple cycles of grain boundary engineering result in a material that resists abnormal grain growth better than other processing routes despite similarities in special boundary fraction, grain size, and general boundary connectivity among as-processed materials. (c) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

【 授权许可】

Free