Development of surface relief on polycrystalline metals due to sputtering

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS

卷:302

Article

Voitsenya, V. S.¹  Balden, M.²  Bardamid, A. F.³  Bondarenko, V. N.¹  Davis, J. W.⁴  Konovalov, V. G.¹  Ryzhkov, I. V.¹  Skoryk, O. O.¹  Solodovchenko, S. I.¹  Zhou Zhang-jian⁵ 

[1] IPP NSC KIPT, UA-61108 Kharkov, Ukraine

[2] Max Planck Inst Plasma Phys, EURATOM Assoc, Garching, Germany

[3] Taras Shevchenko Natl Univ, UA-01033 Kiev, Ukraine

[4] Univ Toronto, Inst Aerosp Studies, Toronto, ON M3H 5T6, Canada

[5] Univ Sci & Technol Beijing, Beijing 100083, Peoples R China

关键词: Sputtering;    Polycrystalline metals;    Surface relief;    Mirror degradation;    Plasma diagnostics;   

DOI  :  10.1016/j.nimb.2013.03.005

来源: Elsevier

【 摘 要 】

The characteristics of surface microrelief that appear in sputtering experiments with polycrystalline metals of various grain sizes have been studied. Specimens with grain sizes varying from 30-70 nm in the case of crystallized amorphous alloys, to 1-3 mu m for technical tungsten grade and 10-100 mu m for recrystallized tungsten were investigated. A model is proposed for the development of roughness on polycrystalline metals which is based on the dependence of sputtering rate on crystal orientation. The results of the modeling are in good agreement with experiments showing that the length scale of roughness is much larger than the grain size. (C) 2013 Elsevier B.V. All rights reserved.

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