期刊论文详细信息
THIN SOLID FILMS 卷:612
Growth and structure of thermally evaporated Bi2Te3 thin films
Article
Rogacheva, E. I.1  Budnik, A. V.1  Dobrotvorskaya, M. V.2  Fedorov, A. G.2  Krivonogov, S. I.2  Mateychenko, P. V.2  Nashchekina, O. N.1  Sipatov, A. Yu.1 
[1] Natl Tech Univ, Kharkov Polytech Inst, 21 Frunze St, UA-61002 Kharkov, Ukraine
[2] Inst Single Crystals NAS Ukraine, 60 Lenin Prospect, UA-61001 Kharkov, Ukraine
关键词: Bismuth telluride;    Thermal evaporation;    Glass substrates;    Polycrystalline thin films;    Grain size;    Crystal structure;    Crystal morphology;    Preferential orientation;   
DOI  :  10.1016/j.tsf.2016.05.046
来源: Elsevier
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【 摘 要 】

The growth mechanism, microstructure, and crystal structure of the polycrystalline n-Bi2Te3 thin films with thicknesses d = 15-350 nm, prepared by thermal evaporation in vacuum onto glass substrates, were studied. Bismuth telluride with Te excess was used as the initial material for the thin film preparation. The thin film characterization was performed using X-ray diffraction, X-ray photoelectron spectroscopy, energy-dispersive X-ray spectroscopy, scan electron microscopy, and electron force microscopy. It was established that the chemical composition of the prepared films corresponded rather well to the starting material composition and the films did not contain any phases apart from Bi2Te3. It was shown that the grain size and the film roughness increased with increasing film thickness. The preferential growth direction changed from [00l] to [015] under increasing d. The X-ray photoelectron spectroscopy studies showed that the thickness of the oxidized surface layer did not exceed 1.5-2.0 nm and practically did not change in the process of aging at room temperature, which is in agreement with the results reported earlier for single crystals. The obtained data show that using simple and inexpensive method of thermal evaporation in vacuum and appropriate technological parameters, one can grow n-Bi2Te3 thin films of a sufficiently high quality. (C) 2016 Elsevier B.V. All rights reserved.

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