Creep performance of transient liquid phase bonded haynes 230 alloy

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

卷:768

Article

Rozman, K. A.^1,2  Carl, M. A.³  Kapoor, M.⁴  Dogan, O. N.¹  Hawk, J. A.¹ 

[1] Natl Energy Technol Lab, 1450 Queen Ave SW, Albany, OR 97321 USA

[2] Leidos Res Support Team, 626 Cochrans Mill Rd,POB 10940, Pittsburgh, PA 15236 USA

[3] ATI Met, 1000 Six PPG Pl, Pittsburgh, PA 15222 USA

[4] Novelis Aditya Birla, 3560 Lenox Rd,Suite 2000, Atlanta, GA 30326 USA

关键词: Characterization;    Electron microscopy;    Fracture mechanics/fracture behavior/fatigue;    Stress/strain measurements;    Nickel alloys;    Grains and interfaces;   

DOI  :  10.1016/j.msea.2019.138477

来源: Elsevier

【 摘 要 】

Creep performance of a potential heat exchanger alloy, Haynes 230 was investigated. To simulate mechanical performance of a heat exchanger, sheet material of Haynes 230 transient liquid phase (UP) bonded together. Sheets were plated on both sides with a Ni-P compound, subsequently stacked and TLP bonded together. Duplicate creep tests show low scatter in creep results, meaning a good repeatable joint was formed by Tip bonding. Overall creep performance showed less ductility and shorter times to failure than specimens originating from plate material. Evolution of a phosphorous compound at the bond line was observed and thought to potentially reduce ductility of the TLP bonded alloy.

【 授权许可】

Free