Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

Chinese Journal of Mechanical Engineering

Review

Xiuli Wang¹  Ying Ding¹  Dan Yu¹  Qilong Guan²  Yanhong Tian²  Shengli Li²  Chunjin Hang² 

[1] Beijing Institute of Control Engineering, 100190, Beijing, China;State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, 150001, Harbin, China;

关键词: Deep space exploration;    Extreme environments;    Solder joints;    Microstructure;    Electronics;    Reliability;   

DOI  :  10.1186/s10033-023-00834-4

 received in 2022-03-24, accepted in 2022-12-27,  发布年份 2022

来源: Springer

【 摘 要 】

The spacecraft for deep space exploration missions will face extreme environments, including cryogenic temperature, intense radiation, wide-range temperature variations and even the combination of conditions mentioned above. Harsh environments will lead to solder joints degradation or even failure, resulting in damage to onboard electronics. The research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices, but effectively improve the overall reliability of spacecraft, which is of great significance to the aviation industry. In this paper, we review the reliability research on SnPb solder alloys, Sn-based lead-free solder alloys and In-based solder alloys in extreme environments, and try to provide some suggestions for the follow-up studies, which focus on solder joint reliability under extreme environments.

【 授权许可】

CC BY   
© The Author(s) 2023

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