A review of typical thermal fatigue failure models for solder joints of electronic components

2017 3rd International Conference on Applied Materials and Manufacturing Technology

Li, Xiaoyan^1 ; Sun, Ruifeng^1 ; Wang, Yongdong^1

China Aero-Polytechnology Establishment, Beijing, China^1

关键词: Cyclic plastic strain;    Elastic strain;    Electronic component;    Literature researches;    Solder joints;    Thermal fatigue failures;    Thermal strain;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/242/1/012103/pdf
DOI  :  10.1088/1757-899X/242/1/012103

来源: IOP

【 摘 要 】

For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.