Investigation of Multicomponent Lead-Free Solders

Archives of Metallurgy and Materials

Gacsi Z.¹  Benke M.¹  Teglas N.¹  Gyenes A.¹  Nagy E.² 

[1] Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, H-3515Miskolc-Egyetemvaros, B1/109., Hungary;MTA-ME Materials Science Research Group, University of Miskolc, H-3515Miskolc-Egyetemvaros, Hungary;

关键词: lead-free solder;    multicomponent;    microstructure;    X-ray diffraction;    mechanical properties;   

DOI  :  10.1515/amm-2017-0156

来源: DOAJ

【 摘 要 】

According to the directives (RoHS and WEEE) adopted by the European Union, lead has been banned from the manufacturing processes because of its health and environmental hazards. Therefore, the development of lead-free solders is one of the most important research areas of the electronic industry. This paper investigates multicomponent Sn-Ag-Cu based lead-free solders with different compositions. The properties of the six-component Innolot (SAC+BiSbNi) and two low-Ag containing alloys were compared with the widespread used SAC307 solder. Microstructure investigations and X-ray diffraction measurements were performed to analyze and identify the formed phases, furthermore, tensile tests and microhardness measurements were executed to determine the mechanical properties of the examined solders.

【 授权许可】

Unknown