Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

Archives of Metallurgy and Materials

Kristaly F.¹  Gacsi Z.²  Gyenes A.²  Nagy E.³ 

[1] INSTITUTE OF MINERALOGY AND GEOLOGY, UNIVERSITY OF MISKOLC, H-3515 MISKOLC-EGYETEMVAROS, HUNGARY;INSTITUTE OF PHYSICAL METALLURGY, METAL FORMING AND NANOTECHNOLOGY, UNIVERSITY OF MISKOLC, H-3515 MISKOLC-EGYETEMVAROS, HUNGARY;MTA-ME MATERIALS SCIENCE RESEARCH GROUP, UNIVERSITY OF MISKOLC, H-3515 MISKOLC-EGYETEMVAROS, HUNGARY;

关键词: intermetallics;    lead-free solder;    X-ray diffraction;   

DOI  :  10.1515/amm-2015-0163

来源: DOAJ

【 摘 要 】

Interfacial intermetallic compounds (IMC) play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.

【 授权许可】

Unknown