Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

Archives of Metallurgy and Materials

F. Kristaly¹  A. Gyenes²  Z. Gacsi²  E. Nagy³ 

[1] INSTITUTE OF MINERALOGY AND GEOLOGY, UNIVERSITY OF MISKOLC, H-3515 MISKOLC-EGYETEMVAROS, HUNGARY;INSTITUTE OF PHYSICAL METALLURGY, METAL FORMING AND NANOTECHNOLOGY, UNIVERSITY OF MISKOLC, H-3515 MISKOLC-EGYETEMVAROS, HUNGARY;MTA-ME MATERIALS SCIENCE RESEARCH GROUP, UNIVERSITY OF MISKOLC, H-3515 MISKOLC-EGYETEMVAROS, HUNGARY

关键词: Keywords: intermetallics;    lead-free solder;    X-ray diffraction;   

DOI  :  10.1515/amm-2015-0163

学科分类：金属与冶金

来源: Akademia Gorniczo-Hutnicza im. Stanislawa Staszica / University of Mining and Metallurgy

【 摘 要 】

Interfacial intermetallic compounds (IMC) play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.

【 授权许可】

Unknown