Novel Fabrication Technology for Clamped Micron-Thick Titanium Diaphragms Used for the Packaging of an Implantable MEMS Acoustic Transducer

Micromachines

Alexander Huber¹  Flurin Pfiffner¹  Lukas Prochazka¹  Naureen Ghafoor²  Jens Birch²  Michael Schneider³ 

[1] Department of Otorhinolaryngology, Head & Neck Surgery, University Hospital Zurich, University of Zurich, 8091 Zurich, Switzerland;Department of Physics, Chemistry and Biology (IFM), Linköping University, 581 83 Linköping, Sweden;SwissNeutronics AG, 5313 Klingnau, Switzerland;

关键词: implantable acoustic transducer;    packaging;    titanium/platinum multi-layer diaphragm;    polymer sacrificial material;    DC magnetron sputtering;    intrinsic stress;   

DOI  :  10.3390/mi13010074

来源: DOAJ

【 摘 要 】

Micro-Electro-Mechanical Systems (MEMS) acoustic transducers are highly sophisticated devices with high sensing performance, small size, and low power consumption. To be applied in an implantable medical device, they require a customized packaging solution with a protecting shell, usually made from titanium (Ti), to fulfill biocompatibility and hermeticity requirements. To allow acoustic sound to be transferred between the surroundings and the hermetically sealed MEMS transducer, a compliant diaphragm element needs to be integrated into the protecting enclosure. In this paper, we present a novel fabrication technology for clamped micron-thick Ti diaphragms that can be applied on arbitrary 3D substrate geometry and hence directly integrated into the packaging structure. Stiffness measurements on various diaphragm samples illustrate that the technology enables a significant reduction of residual stress in the diaphragm developed during its deposition on a polymer sacrificial material.

【 授权许可】

Unknown