Dynamic crosstalk analysis of mixed multi-walled carbon nanotube bundle interconnects

The Journal of Engineering

¹  Manoj Kumar Majumder²  Brajesh Kumar Kaushik²  Pankaj Kumar Das³ 

[1] ;Indian Institute of Technology Roorkee;Sant Longowal Institute of Engineering and Technology;

关键词: integrated circuit interconnections;    carbon nanotubes;    crosstalk;    nanoelectronics;    integrated circuit modelling;    transmission line theory;    VLSI;    dynamic crosstalk analysis;    mixed multiwalled carbon nanotube bundle interconnects;    MWCNT bundle;    nanoscale VLSI interconnects;    bundle analytical model;    multiconductor transmission line theory;    equivalent single conductor model;    MMB arrangements;    ESC model;    dynamic crosstalk delay;    input transition time;    spacing conditions;   

DOI  :  10.1049/joe.2013.0272

来源: DOAJ

【 摘 要 】

Multi-walled carbon nanotube (MWCNT) bundles have potentially provided attractive solutions in current nanoscale VLSI interconnects. From fabrication point of view, it is difficult to control the growth of a densely packed bundle having MWCNTs with similar diameters. A realistic bundle is combination of MWCNTs with different number of shells. Thus, this research work focuses on the analytical model of a bundle having the MWCNTs with different number of shells or in turn different diameters [mixed MWCNT bundle (MMB)]. Based on the multi-conductor transmission line theory, an equivalent single conductor (ESC) model is employed for the proposed MMB arrangements. The ESC model of MMB is used to compare the dynamic crosstalk delay with conventionally arranged bundle containing MWCNTs with similar diameters [MWCNT bundle (MB)] under different input transition time and spacing conditions. It is observed that a realistic MMB correctly estimates the crosstalk delay for the different transition time that overestimates the delay of a conventionally arranged MB by 1.35 times. Moreover, the MMB arrangement reduces the overall crosstalk delay by 47.26% compared with the conventional MB arrangements for an inter-bundle spacing ranging from 5 to 30 nm.

【 授权许可】

Unknown