Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre

IEEE Photonics Journal

Sangyoon Han¹  Tae Joon Seok¹  Niels Quack¹  Ming C. Wu¹  Richard S. Muller¹  Dylan Knutson²  Hannah R. Grant²  George C. Papen²  Alex Forencich²  How Yuan Hwang³  Jun Su Lee³  Peter O'Brien³ 

[1] Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA;Department of Electrical and Computer Engineering, University of California, San Diego, CA, USA;Tyndall National Institute, University College Cork, Cork, Ireland;

关键词: Flip chip;    interposer;    micro-electro-mechanical system (MEMS) packaging;    optical switches;    silicon photonics.;   

DOI  :  10.1109/JPHOT.2017.2704097

来源: DOAJ

【 摘 要 】

We report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 × 12 switching ports. The challenges in packaging N ² electrical and 2N optical interconnections are addressed with single-layer electrical redistribution lines of 25 μm line width and space on aluminum nitride interposer and 13° polished 64-channel lidless fiber array (FA) with a pitch of 127 μm. 50 μm diameter solder spheres are laser-jetted onto the electrical bond pads surrounded by suspended MEMS actuators on the device before fluxless flip-chip bonding. A lidless FA is finally coupled near-vertically onto the device gratings using a 6-degree-of-freedom (6-DOF) alignment system. Fiber-to-grating coupler loss of 4.25 dB/facet, 10^-11 bit error rate (BER) through the longest optical path, and 0.4 μs switch reconfiguration time have been demonstrated using 10 Gb/s Ethernet data stream.

【 授权许可】

Unknown