A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package

Applied Sciences

He Zhang¹  Yuan Huang¹  Chunjin Hang¹  Chunqing Wang¹  Chenxi Wang¹  Zhen Zheng¹  Yanhong Tian¹ 

[1] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;

关键词: electrodeposition;    electronic materials;    interposer;    electronic package;   

DOI  :  10.3390/app8112188

来源: DOAJ

【 摘 要 】

Though copper nano-pillars (CNPs) filled in anodic aluminum oxide (AAO) film has been developed for many years, the high pore-filling percentage in AAO is still a bottleneck. We have demonstrated a new electrodeposition method to fill CNPs in AAO without the seed layer which is required in the traditional electrodeposition process. CNPs with uniform heights were obtained and the pore-filling percentage reached up to 97.5%. Low current density is beneficial for the high pore-filling percentage due to the uniform growing rate in different nanoscale pores. The high temperature increased the diffusion velocity of ions and enhanced the pore filling percentage but also corroded the AAO film simultaneously. Results showed that CNPs grains with <220> orientation were fabricated. Electrodeposition with low electric current could contribute to the forming of CNPs with (220) preferred orientation due to the promotion of dehydration reduction processes. The thermal conductivities of Cu-AAO interposers reaches 92.34 W/(m·K) and 3.19 W/(m·K) in vertical and horizontal directions, respectively.

【 授权许可】

Unknown