Novel 3D Pixel Sensors for the Upgrade of the ATLAS Inner Tracker

Frontiers in Physics

Giulia Giannini¹  Stefano Terzo¹  Maria Manna¹  Giulio Pellegrini¹  David Quirion¹  Juan Carlotto¹  Sebastian Grinstein²  Simon Huiberts³  Magne Elk Lauritzen³  Bjarne Stugu³  Claudia Gemme⁴  Giuseppe Gariano⁴  Hideyuki Oide⁴  Giovanni Darbo⁴  Alessandro Lapertosa⁵  Leonardo Vannoli⁵  Heidi Sandaker⁶  Marco Povoli⁶  Ozhan Koybasi⁶  Ole Myren Rohne⁶  Ole Dorholt⁶  Angela Kok⁶  Andreas Heggelund⁶  Maurizio Boscardin⁷  Francesco Ficorella⁷  Sabina Ronchin⁷  Md. Arif Abdulla Samy⁸  Gian-Franco Dalla Betta⁸  Roberto Mendicino⁹ 

[1]Barcelona, Spain

[2]Barcelona, Spain

[3]Barcelona, Spain

[4]Bergen, Norway

[5]Genoa, Italy

[6]Genoa, Italy

[7]Genoa, Italy

[8]Oslo, Norway

[9]Trento, Italy

[10]Trento, Italy

[11]Trento, Italy

[12]Trento, Italy

[13]Trento, Italy

[14]Trento, Italy

关键词: solid state detectors;    radiation-hard charged-particle detectors;    3D silicon detectors;    tracking detectors;    ATLAS experiment;    high energy physics (HEP);   

DOI  :  10.3389/fphy.2021.624668

来源: Frontiers

【 摘 要 】

The ATLAS experiment will undergo a full replacement of its inner detector to face the challenges posed by the High Luminosity upgrade of the Large Hadron Collider (HL-LHC). The new Inner Tracker (ITk) will have to deal with extreme particle fluences. Due to its superior radiation hardness the 3D silicon sensor technology has been chosen to instrument the innermost pixel layer of ITk, which is the most exposed to radiation damage. Three foundries (CNM, FBK, and SINTEF), have developed and fabricated novel 3D pixel sensors to meet the specifications of the new ITk pixel detector. These are produced in a single-side technology on either Silicon On Insulator (SOI) or Silicon on Silicon (Si-on-Si) bonded wafers by etching both n- and p-type columns from the same side. With respect to previous generations of 3D sensors they feature thinner active substrates and smaller pixel cells of 50 × 50 and 25 × 100 µm2. This paper reviews the main design and technological issues of these novel 3D sensors, and presents their characterization before and after exposure to large radiation doses close to the one expected for the innermost layer of ITk. The performance of pixel modules, where the sensors are interconnected to the recently developed RD53A chip prototype for HL-LHC, has been investigated in the laboratory and at beam tests. The results of these measurements demonstrate the excellent radiation hardness of this new generation of 3D pixel sensors that enabled the project to proceed with the pre-production for the ITk tracker.

【 授权许可】

CC BY