Advances in 3D Sensor Technology by Using Stepper Lithography

Frontiers in Physics

Adriano Lai¹  Marco Meschini²  Sara Ferrari³  Roberto Mendicino³  Md. Arif Abdulla Samy⁴  Maurizio Boscardin⁴  Francesco Ficorella⁴  Gian-Franco Dalla Betta⁴  Sabina Ronchin⁴ 

[1]Monserrato, Italy

[2]Sesto Fiorentino, Italy

[3]Trento, Italy

[4]Trento, Italy

[5]Trento, Italy

关键词: 3D silicon detectors;    stepper;    electrical characterisation;    fabrication yield;    fabrication process;   

DOI  :  10.3389/fphy.2020.625275

来源: Frontiers

【 摘 要 】

3D pixel sensors aimed at the upgrades of the ATLAS and CMS experiments at the High Luminosity LHC have small pixel size and pretty dense layouts. In addition, modified 3D designs with small pixel size and trenched electrodes in place of columnar electrodes are being developed to optimize the pixel timing performance in view of the LHCb upgrade. The fabrication of these advanced 3D pixels is challenging from the lithographical point of view. This motivated the use of stepper lithography at Fondazione Bruno Kessler in place of a standard mask aligner. The small minimum feature size and high alignment accuracy of stepper allow a good definition of the sensor geometries also in the most critical layouts, so that a higher fabrication yield can be obtained. In this paper, we will present the main design and technological issues and discuss their impact on the electrical characteristics of 3D pixel sensors of different geometries.

【 授权许可】

CC BY