Simultaneous fabrication of a through-glass interconnect via and a bump using dry film resist and submicron gold particles

Micro & nano letters

article

Hayata Mimatsu¹  Jun Mizuno²  Shuichi Shoji¹  Takashi Kasahara¹  Kailing Shih¹  Kazuya Nomura¹  Yukio Kanehira³  Toshinori Ogashiwa³ 

[1] Department of Nanoscience and Nanoengineering, Waseda University;Institute for Nanoscience and Nanotechnology, Waseda University;Tanaka Kikinnzoku Kogyo K.K.

关键词: titanium;    platinum;    gold;    sputter deposition;    photoresists;    photolithography;    adhesion;    electrical resistivity;    scanning electron microscopy;    thin films;    integrated circuit interconnections;    integrated circuit packaging;    through-glass interconnect vias;    dry film resist;    submicron gold particles;    sputter deposition;    adhesion;    glass substrate;    photolithography;    two-electrode method;    sintering;    TGV;    four-wire ohm method;    bump bonding;    fractured bumps;    scanning electron microscopy;    packaging processes;    glass integrated circuit chips;    Ti-Pt-Au-SiO2;   

DOI  :  10.1049/mnl.2014.0187

学科分类：计算机科学（综合）

来源: Wiley

【 摘 要 】

A process for the simultaneous fabrication of through-glass interconnect vias (TGVs) and gold (Au) bumps using dry film resist and submicron Au particles is proposed. A Ti/Pt/Au layer was sputtered on the top and bottom surfaces of glass vias to improve the adhesion between the glass substrate and submicron Au particles. The submicron Au particles filled the resist holes and glass vias fabricated by photolithography and by the two-electrode method, respectively, and were then sintered. The height and diameter of the fabricated Au bumps were about 20–25 and 200 µm, respectively. The Ti/Pt/Au layer on the surface of the glass substrate was removed by Ar ion milling to isolate each bump electrically. The resistance of a single Au bump and TGV was evaluated using the four-wire ohm method to be about 0.05 Ω. Furthermore, Au bump bonding was demonstrated. Fractured Au bumps and TGVs were observed by scanning electron microscopy after the bonded sample was peeled. It is expected that this fabrication process using a dry film resist and submicron Au particles will be useful in simple packaging processes to form glass interposer substrates or glass integrated circuit chips.

【 授权许可】

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