Low-Power Resistive Switching Characteristic in HfO2/TiOx Bi-Layer Resistive Random-Access Memory

Nanoscale Research Letters

Jinfeng Kang¹  Peng Huang¹  Yulin Feng¹  Lifeng Liu¹  Xiangxiang Ding¹ 

[1] Institute of Microelectronics, Peking University, 100871, Beijing, China;

关键词: RRAM;    Low power;    Atomic layer deposition;    Titanium oxide;   

DOI  :  10.1186/s11671-019-2956-4

来源: Springer

【 摘 要 】

Resistive random-access memory devices with atomic layer deposition HfO2 and radio frequency sputtering TiOx as resistive switching layers were fabricated successfully. Low-power characteristic with 1.52 μW set power (1 μA@1.52 V) and 1.12 μW reset power (1 μA@1.12 V) was obtained in the HfO2/TiOx resistive random-access memory (RRAM) devices by controlling the oxygen content of the TiOx layer. Besides, the influence of oxygen content during the TiOx sputtering process on the resistive switching properties would be discussed in detail. The investigations indicated that “soft breakdown” occurred easily during the electrical forming/set process in the HfO2/TiOx RRAM devices with high oxygen content of the TiOx layer, resulting in high resistive switching power. Low-power characteristic was obtained in HfO2/TiOx RRAM devices with appropriately high oxygen vacancy density of TiOx layer, suggesting that the appropriate oxygen vacancy density in the TiOx layer could avoid “soft breakdown” through the whole dielectric layers during forming/set process, thus limiting the current flowing through the RRAM device and decreasing operating power consumption.

【 授权许可】

CC BY