Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors

Sensors

Seiichi Takamatsu¹  Hisanori Takano²  Nguyen Binh-Khiem²  Tomoyuki Takahata²  Eiji Iwase²  Kiyoshi Matsumoto² 

[1] The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo, Japan;

关键词: glucose sensor;    glucose oxidase;    Parylene;    packaging;   

DOI  :  10.3390/s100605888

来源: mdpi

【 摘 要 】

We have developed a package for disposable glucose sensor chips using Parylene encapsulation of a glucose oxidase solution in the liquid phase and a cover structure made of an ultraviolet (UV) curable adhesive. Parylene was directly deposited onto a small volume (1 μL) of glucose oxidase solution through chemical vapor deposition. The cover and reaction chamber were constructed on Parylene film using a UV-curable adhesive and photolithography. The package was processed at room temperature to avoid denaturation of the glucose oxidase. The glucose oxidase solution was encapsulated and unsealed. Glucose sensing was demonstrated using standard amperometric detection at glucose concentrations between 0.1 and 100 mM, which covers the glucose concentration range of diabetic patients. Our proposed Parylene encapsulation and UV-adhesive cover form a liquid phase glucose-oxidase package that has the advantages of room temperature processing and direct liquid encapsulation of a small volume solution without use of conventional solidifying chemicals.

【 授权许可】

CC BY   
© 2010 by the authors; licensee MDPI, Basel, Switzerland.