A Wireless Passive Pressure Microsensor Fabricated in HTCC MEMS Technology for Harsh Environments

Sensors

Qiulin Tan¹  Hao Kang¹  Jijun Xiong¹  Li Qin¹  Wendong Zhang¹  Chen Li¹  Liqiong Ding¹  Xiansheng Zhang¹ 

[1] Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Taiyuan 030051, China; E-Mails:

关键词: wireless passive;    high-temperature co-fired ceramics (HTCC);    LC circuit mutual inductance coupling;   

DOI  :  10.3390/s130809896

来源: mdpi

【 摘 要 】

A wireless passive high-temperature pressure sensor without evacuation channel fabricated in high-temperature co-fired ceramics (HTCC) technology is proposed. The properties of the HTCC material ensure the sensor can be applied in harsh environments. The sensor without evacuation channel can be completely gastight. The wireless data is obtained with a reader antenna by mutual inductance coupling. Experimental systems are designed to obtain the frequency-pressure characteristic, frequency-temperature characteristic and coupling distance. Experimental results show that the sensor can be coupled with an antenna at 600 °C and max distance of 2.8 cm at room temperature. The senor sensitivity is about 860 Hz/bar and hysteresis error and repeatability error are quite low.

【 授权许可】

CC BY   
© 2013 by the authors; licensee MDPI, Basel, Switzerland.