Thermophysical and Mechanical Properties of Hardened Cement Paste with Microencapsulated Phase Change Materials for Energy Storage

Materials

Hongzhi Cui²  Wenyu Liao²  Shazim Ali Memon¹  Biqin Dong²  Waiching Tang³ 

[1] Department of Civil Engineering, COMSATS Institute of Information Technology, Abbottabad Campus, Abbottabad 22010, Pakistan; E-Mail:;Guangdong Provincial Key Laboratory of Durability for Marine Civil Engineering, College of Civil Engineering, Shenzhen University, Shenzhen 518060, China; E-Mails:;School of Architecture and Built Environment, the University of Newcastle, Callaghan, NSW 2308, Australia; E-Mail:

关键词: microencapsulated phase change material (MPCM);    cement-based materials;    thermal energy storage;    mechanical properties;    thermal properties;   

DOI  :  10.3390/ma7128070

来源: mdpi

【 摘 要 】

In this research, structural-functional integrated cement-based materials were prepared by employing cement paste and a microencapsulated phase change material (MPCM) manufactured using urea-formaldehyde resin as the shell and paraffin as the core material. The encapsulation ratio of the MPCM could reach up to 91.21 wt%. Thermal energy storage cement pastes (TESCPs) incorporated with different MPCM contents (5%, 10%, 15%, 20% and 25% by weight of cement) were developed, and their thermal and mechanical properties were studied. The results showed that the total energy storage capacity of the hardened cement specimens with MPCM increased by up to 3.9-times compared with that of the control cement paste. The thermal conductivity at different temperature levels (35–36 °C, 55–56 °C and 72–74 °C) decreased with the increase of MPCM content, and the decrease was the highest when the temperature level was 55–56 °C. Moreover, the compressive strength, flexural strength and density of hardened cement paste decreased with the increase in MPCM content linearly. Among the evaluated properties, the compressive strength of TESCPs had a larger and faster degradation with the increase of MPCM content.

【 授权许可】

CC BY   
© 2014 by the authors; licensee MDPI, Basel, Switzerland.