A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

Materials

Enrico Mick¹  Joachim Tinschert²  Aurica Mitrovic³  Rainer Bader¹ 

[1] Biomechanics and Implant Technology Research Lab, Department of Orthopaedics, University Medicine Rostock, Doberaner Strasse 142, Rostock 18057, Germany; E-Mail:;Praxis fuer Zahnheilkunde, Holzgraben 1–3, Aachen 52062, Germany; E-Mail:;ZM Praezisionsdentaltechnik GmbH, Breite Strasse 16, Rostock 18055, Germany; E-Mail:

关键词: ceramics;    titanium;    bonding;    glass solder;    four-point-bending;   

DOI  :  10.3390/ma8074287

来源: mdpi

【 摘 要 】

Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm) made of alumina toughened zirconia (ATZ), as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM) and energy-dispersive X-ray (EDX) analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

【 授权许可】

CC BY   
© 2015 by the authors; licensee MDPI, Basel, Switzerland.