Microstructure and Properties of Porous Si3N4/Dense Si3N4 Joints Bonded Using RE–Si–Al–O–N (RE = Y or Yb) Glasses

Metals

Chunfeng Liu¹  Xinhua Wang¹  Xuanzhi Wang¹  Ling Li¹  Liangbo Sun¹  Jie Zhang¹ 

[1] School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China;

关键词: silicon nitride;    glass solder;    β-SiAlON;    joining;    infiltration;   

DOI  :  10.3390/met7110500

来源: DOAJ

【 摘 要 】

The joining of porous Si3N4 to dense Si3N4 ceramics has been successfully performed using mixed RE2O3 (RE = Y or Yb), Al2O3, SiO2, and α-Si3N4 powders. The results suggested that the α-Si3N4 powders partly transformed into β-SiAlON and partly dissolved into oxide glass to form oxynitride glass. Thus, composites of glass/β-SiAlON-ceramic formed in the seam of joints. Due to the capillary action of the porous Si3N4 ceramic, the molten glass solder infiltrated into the porous Si3N4 ceramic side during the joining process and formed the “infiltration zone” with a thickness of about 400 μm, which contributed to the heterogeneous distribution of the RE–Si–Al–O–N glasses in the porous Si3N4 substrate. In-situ formation of β-SiAlON in the seam resulted in a high bonding strength. The maximum bending strength of 103 MPa and 88 MPa was reached for the porous Si3N4/dense Si3N4 joints using Y–Si–Al–O–N and Yb–Si–Al–O–N glass solders, respectively.

【 授权许可】

Unknown