Different encapsulation strategies for implanted electronics

Current Directions in Biomedical Engineering

Welsch Christine¹  Ruff Roman¹  Winkler Sebastian²  Edelmann Jan² 

[1] Fraunhofer Institute for Biomedical Engineering IBMT, Ensheimer Strasse 48, 66386 St. Ingbert, Germany;Fraunhofer Institute for Machine Tools and Forming Technology, Reichenhainer Straße 88, 09126 Chemnitz, Germany;

关键词: implant;    encapsulation;    titanium;    silicone;    ceramics;   

DOI  :  10.1515/cdbme-2017-0153

来源: DOAJ

【 摘 要 】

Recent advancements in implant technology include increasing application of electronic systems in the human body. Hermetic encapsulation of electronic components is necessary, specific implant functions and body environments must be considered. Additional functions such as wireless communication systems require specialized technical solutions for the encapsulation.

【 授权许可】

Unknown