A study on electro thermal response of SiC power module during high temperature operation

IEICE Electronics Express

Tsuyoshi Funaki¹  Akira Nishio³  Takashi Hikihara³  Tsunenobu Kimoto² 

[1] Osaka University, Div. of Electrical, Electronic and Information Eng. Graduate school of Engineering;Kyoto University, Dept. of Electronic Science and Eng. Graduate school of Engineering;Kyoto University, Dept. of Electrical Eng.

关键词: temperature characteristics;    SiC;    power module;    thermal distribution;    thermal conduction;   

DOI  :  10.1587/elex.5.597

学科分类：电子、光学、磁材料

来源: Denshi Jouhou Tsuushin Gakkai

【 摘 要 】

References(6)Cited-By(1)This paper focuses on using high temperature operating capability of SiC power devices, which are packaged in power modules. A SiC Schottky barrier diode is mounted on an active metal brazed Si3N4 substrate as a heat resistive power module. The temperature dependency of electrical characteristics of the SiC device and thermal dynamics of the power module are modeled for numerical electro thermal analysis. The results of numerical analysis demonstrate high temperature operation of SiC device in the power module, which assumes less heat dissipation by simplified cooling system. The experimental results validate the numerical analysis results of the modeled SiC power module.

【 授权许可】

Unknown