Dynamic thermal management for 3D multicore processors under process variations

IEICE Electronics Express

Sungho Kang¹  Hyejeong Hong¹  Jaeil Lim¹  Hyunyul Lim¹ 

[1] School of Electrical and Electronic Engineering, Yonsei University

关键词: 3D;    multicore;    dynamic thermal management;    process variations;   

DOI  :  10.1587/elex.10.20130800

学科分类：电子、光学、磁材料

来源: Denshi Jouhou Tsuushin Gakkai

【 摘 要 】

References(8)Stacking core layers is emerging as an alternative for future high performance computing, but thermal problems have to be tackled first. When adaptive voltage scaling is adopted to hide the growing variation in the performance of cores, as a result, heat generation of each core varies. By exploiting the static thermal characteristics, the efficiency of dynamic thermal management can be improved. The proposed thermal management reduces the energy consumption by up to 30.02% compared with existing techniques, while keeping the ratio of temperature violations around 1%.

【 授权许可】

Unknown