Thermal buckling analysis of laminated hybrid beam with variable piezoelectric layer thicknesses

1st International Conference on Contemporary Research in Mechanical Engineering with Focus on Materials and Manufacturing

机械制造;材料科学

Rahman, N.^1 ; Alam, M.N.^1

Department of Mechanical Engineering, Zakir Husain College of Engineering and Technology, A. M. U. Aligarh, Uttar Pradesh, India^1

关键词: Buckling temperature;    Closed circuit conditions;    Elastic substrate;    Piezoelectric layers;    Simply supported;    Thermal buckling;    Thermal variables;    Uniform temperature;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/404/1/012018/pdf
DOI  :  10.1088/1757-899X/404/1/012018

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Thermal buckling analysis of a laminated hybrid beam with surface mounted piezoelectric layers is presented in this work. A one dimensional finite element (1D-FE) model based on efficient layerwise (zigzag) theory is used for the analysis. Two noded and three noded 1D elements are utilized for interpolating electromechanical and thermal variables respectively. Piezoelectric layers are bonded to top and bottom surfaces of the elastic substrate of hybrid beam.The beams are subjected to uniform temperature with closed circuit condition at top and bottom surfaces. The thicknesses of piezoelectric layers are varied and its effect on critical buckling temperatures is studied. Results are presented for composite and sandwich beam configurations under simply supported boundary conditions. The 1D-FE results are compared with the 2D-FE results obtained using commercial FE package ABAQUS.