Buckling analysis of SMA bonded sandwich structure _ using FEM

7th National Conference on Processing and Characterization of Materials

Katariya, Pankaj V.^1 ; Das, Arijit^1 ; Panda, Subrata K.^1

Department of Mechanical Engineering, NIT Rourkela, Rourkela, Odisha

769008, India^1

关键词: Buckling analysis;    Buckling temperature;    Finite element solution;    Generalized eigenvalue equations;    Geometrical distortion;    Material non-linearity;    Structural parameter;    Thermal buckling;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/338/1/012035/pdf
DOI  :  10.1088/1757-899X/338/1/012035

来源: IOP

【 摘 要 】

Thermal buckling strength of smart sandwich composite structure (bonded with shape memory alloy; SMA) examined numerically via a higher-order finite element model in association with marching technique. The excess geometrical distortion of the structure under the elevated environment modeled through Green's strain function whereas the material nonlinearity counted with the help of marching method. The system responses are computed numerically by solving the generalized eigenvalue equations via a customized MATLAB code. The comprehensive behaviour of the current finite element solutions (minimum buckling load parameter) is established by solving the adequate number of numerical examples including the given input parameter. The current numerical model is extended further to check the influence of various structural parameter of the sandwich panel on the buckling temperature including the SMA effect and reported in details.