Micro-grooving of silicon wafer by Nd:YAG laser beam machining

International Conference on Mechanical, Materials and Renewable Energy

机械制造;材料科学;能源学

Sherpa, Tashi D.^1 ; Pradhan, B.B.^1

Department of Mechanical Engineering, Sikkim Manipal Institute of Technology, Majitar, Rangpo east Sikkim, India^1

关键词: Diode currents;    Machining Process;    Manufacturing process;    Micro grooving;    ND : YAG lasers;    Nd:YAG laser beams;    Process parameters;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/377/1/012219/pdf
DOI  :  10.1088/1757-899X/377/1/012219

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Laser beam machining process is one of the thermal advanced machining processes use for machining all the types of metals, non metals, ceramics, semiconductor, polymeric materials and alloys. For the past few decades laser Beams are being used in various manufacturing processes. Viewing this fact, the researchers have explored number of ways to improve micromachining using Nd: YAG lasers of different materials in recent years. Hence, the present research attempts to explore the effects of the different process parameters such as diode current, frequency, on surface roughness, MRR during micro-grooving of silicon wafer.