Thermal transport study across interface "nanostructured solid surface / fluid" by photoacoustic technique

Eurotherm Seminar No 108 - Nanoscale and Microscale Heat Transfer V

Voitenko, K.^1 ; Isaiev, M.^1,2 ; Pastushenko, A.^3 ; Andrusenko, D.^1 ; Kuzmich, A.^1 ; Lysenko, V.^3 ; Burbelo, R.^1

Taras Shevchenko National University of Kyiv, 64/13, Volodymyrska Str., Kiev

01601, Ukraine^1

Laboratoire LEMTA, Faculté des Sciences et Technologies, CNRS UMR 7563, Université de Lorraine, BP 70239, Vandoeuvre les Nancy Cedex

54506, France^2

University of Lyon, Nanotechnology Institute of Lyon, UMR CNRS 5270, INSA de Lyon, F69621, France^3

关键词: Amplitude frequency;    Elastic stress;    Nano-structured;    Photoacoustic signals;    Photoacoustic techniques;    Porous silicon surfaces;    Thermal perturbations;    Thermal transport;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/785/1/012010/pdf
DOI  :  10.1088/1742-6596/785/1/012010

来源: IOP

【 摘 要 】

In the paper the experimental study of heat transport across the interface "porous silicon/liquid" by photoacoustic technique is reported. Two cases with and without liquid covering of porous silicon surface were considered. Thermal perturbations were excited at the surface of porous silicon as a result of absorption of the light with modulated intensity. The resulting thermal-elastic stresses arising in the system were registered with piezoelectric transducer. The amplitude-frequency dependencies of the voltage on the piezoelectric electrodes were measured. The presence of the liquid film leads to decreasing of the amplitude of photoacoustic signal as a result of the thermal energy evacuation from the porous silicon into the liquid. The experimental dependencies were fitted with the results of simulation that takes into account heat fluxes separation at the porous silicon/liquid interface. With the presented method one can precisely measure heat fluxes transferred from the solid into contacting fluid. Moreover, the presented approach can be easily adopted for the thermal conductivity study of the different nanofluids as well as thermal resistance at the interface nanostructured solid/fluid.