IR Thermal Imaging Device using Photo-Patternable Temperature Sensitive Paint

14th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications

物理学;能源学

Tsukamoto, T.^1 ; Wang, M.^1 ; Tanaka, S.^1

Department of Bioengineering and Robotics, Tohoku University, 6-6-01, Aoba Aza Aramaki, Aoba-ku, Miyagi, Sendai

980-8579, Japan^1

关键词: Fabrication process;    Infrared-to-visible;    Plasma induced damage;    Temperature sensitive paint;    Thermal imaging applications;    Thermal imaging devices;    Transducer array;    Transfer method;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/557/1/012066/pdf
DOI  :  10.1088/1742-6596/557/1/012066

来源: IOP

【 摘 要 】

This paper reports an infrared-to-visible transducer array made of temperature sensitive paint (TSP) for low-cost thermal imaging application. A novel fabrication process using a photo-patternable temperature sensitive paint (PTSP) combined with an SU-8 transfer method was developed. The developped process is simpler than before, and prevents the TSP structure from plasma-induced damage and sticking across a sacrificially-etched gap. The selfsuspended structure as small as 100 pm was successfully fabricated with a large gap of 40 μm from the substrate. The heated object of 300°C was detected with a resolution of about 0.4 mm.