A low-frequency of electrical stimulation improves wound healing

1st International Conference on Life and Applied Sciences for Sustainable Rural Development

生态环境科学

Sari, Yunita^1 ; Isworo, Atyanti^1 ; Upoyo, Arif Setyo^1 ; Anam, Akhyarul^1 ; Hartono^2 ; Sutrisna, Eman^3 ; Saryono^1

Department of Nursing, Faculty of Health Sciences, Universitas Jenderal Soedirman, Purwokerto

53123, Indonesia^1

Department of Physics Science, Faculty of Sciences, Universitas Jenderal Soedirman, Purwokerto

53123, Indonesia^2

Department of Pharmacology, Faculty of Medicine, Universitas Jenderal Soedirman, Purwokerto

53123, Indonesia^3

关键词: Control groups;    Electrical stimulations;    High frequency HF;    Low-frequency;    Polymorphonuclear neutrophils;    Reepithelialisation;    Wound healing;   

Others  :  https://iopscience.iop.org/article/10.1088/1755-1315/255/1/012014/pdf
DOI  :  10.1088/1755-1315/255/1/012014

学科分类：环境科学（综合）

来源: IOP

【 摘 要 】

High frequency of electrical stimulation (ES) can cause patients to become uncomfortable. Therefore, it needs to use a low frequency of ES. However, the use of low frequency of ES (below 20 Hz) on wound healing is still unclear. Therefore, this study aimed to elucidate the effect of low frequency (10 Hz) of ES on wound healing. A wound with a diameter of one cm was created at the dorsal side of rats. The rats were divided into two groups; low frequency of electrical stimulation (LFES), and control group (without ES application). The application of ES was given for ten days. The wound size in the LFES group was smaller in LFES group compared to the control group. The intensity of polymorphonuclear neutrophils was lower in the LFES group, while the intensity of fibroblast was significantly higher in the LFES than in the control group. The formation of new epidermis (reepithelialisation) was faster in LFES group than in the control groups. Low frequency of ES (10 Hz) accelerated wound healing by reducing inflammation, improving the fibroblast intensity, and formation of new epidermis.