Study on transient heat transfer at metal to dielectric interfaces in the temperature range between 3.5 K and 30 K

27th International Cryogenics Engineering Conference and International Cryogenic Materials Conference 2018

Koettig, T.^1 ; Golm, J.^1 ; Liberadzka, J.^1 ; Borges De Sousa, P.^1 ; Bremer, J.^1

CERN, Geneva

CH

1211, Switzerland^1

关键词: Dielectric interface;    Experimental platform;    Frequency dependence;    Interface thermal resistance;    Measurement methodology;    Steady state and transients;    Thermal conductance;    Transient heat transfer;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/502/1/012094/pdf
DOI  :  10.1088/1757-899X/502/1/012094

来源: IOP

【 摘 要 】

The thermal conductivity and diffusivity across a combination of metallic and insulating layers are important thermodynamic input parameters for cooling studies of composite materials or assemblies built out of layers of different electrical and thermal conductivity. The dynamic response of such thermal contacts across electrically insulating layers can be expressed in terms of a diffusivity-like value, which is giving insight on the interface thermal resistance. A two-stage cryocooler based test stand is used to measure the thermal conductance of samples. Variable base temperatures of the experimental platform at the cryocooler allow for steady-state and transient heat flux measurements up to 30 K. This paper describes the measurement methodology applied to such kind of non-uniform sample compositions, especially the frequency dependence of the diffusivity values is discussed.Published under licence by IOP Publishing Ltd.