学位论文

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× Glass interposer

全选【符合条件的数据共：3条】

1 Thermal performance enhancement of packaging substrates with integrated vapor chamber [学位论文]

作者:Cho, Sangbeom, Joshi, Yogendra Tummala, Rao Mechanical Engineering Sitaraman, Suresh Graham, Samuel Sundaram, Venkatesh, Joshi, Yogendra

论文开放时间:2018

关键词:Glass interposer;TPV;...

培养单位:University:Georgia Institute of Technology

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2 Modeling, design, and demonstration of 2.5-D glass interposer packages for high performance computing applications [学位论文]

作者:Sawyer, Brett Michael Dunn, Tummala, Rao R. Electrical and Computer Engineering Peterson, Andrew F. Sitaraman, Suresh Brand, Oliver Sundaram, Venkatesh, Tummala, Rao R.

论文开放时间:2017

关键词:2.5-D interposer;Electronics packaging;...

培养单位:University:Georgia Institute of Technology

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3 Impact of fabrication process variations on the electrical performance of impedance controlled 2 micron multilayer redistribution layers (RDL) on glass interposers [学位论文]

作者:Lu, Hao, Tummala, Rao R. Electrical and Computer Engineering Peterson, Andrew F. Brand, Oliver Sitaraman, Suresh K. Sundaram, Venky, Tummala, Rao R.

论文开放时间:2017

关键词:Multilayer RDL;Process variations;...

培养单位:University:Georgia Institute of Technology

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摘要