TSV 모델을 포함하는 상위 레벨 3D-IC 열 시뮬레이터

열 시뮬레이터;TSV;621

공과대학 전기·컴퓨터공학부 ;

University:서울대학교 대학원

关键词: 열 시뮬레이터;    TSV;    621;   

Others  :  http://s-space.snu.ac.kr/bitstream/10371/123105/1/000000022118.pdf

美国|英语

来源: Seoul National University Open Repository

【 摘 要 】

A High Level Thermal 3D-IC simulator including TSV model성 명 Sunwook Kim학과 및 전공 Electrical EngineeringThe Graduate SchoolSeoul National University For decades, the main interest in semiconductor technology has been in increasing the degree of integration. However, the increase in integration on 2D ICs (integrated circuits) is approaching to its limit. So methods of stacking dies are considered to be a promising technology.3D stacked die is far more scalable and allows higher degree of integration compared to 2D die. It shortens wire lengths and decreases not only critical path delays but also power consumed by wires. But as the result of stacking, the density of power dissipation rises whereas the area of the surface contacting air decreases.To analyze and solve the thermal problems, a thermal simulator that can estimate temperature is required. There are two aspects of thermal analysis. One is steady state analysis and the other is transient analysis. There are many existing simulators for thermal analysis of 2D-ICs. But there are a few simulators that can analyze 3D-ICs and none of them can perform both steady state and transient analysis while considering TSVs.TSVs made up of copper connect wires on different stacked dies using cylindrical holes through the dies. The copper of the TSVs fills up the cylindrical holes for the connection. As well as connecting wires, TSVs also help dissipating the heat. TSVs commonly connect multiple dies within a package to the spreader and heatsink then they makes it easy to exchange heat. In fact, the thermal conductance of a TSV of copper is higher than that of a chip of silicon. Moreover, since TSVs connect different dies through BEOL(back end of line) and TIM(thermal interface material) layers which blocks heat flow, they help a lot with heat dissipation. As a result there have been many attempts of solving the heat problems with TSVs.This paper presents an approach to the development of a simulator that can analyze both steady state and transient temperatures in 3D ICs with TSVs and shows the effectiveness with some experiments.