Architecting heterogeneous memory systems with 3D die-stacked memory

Stacked DRAM;Die-stacking;Memory systems;Heterogeneous memory;Hardware management;Computer architecture

Sim, Jae Woong ; Kim, Hyesoon Electrical and Computer Engineering Yalamanchili, Sudhakar Prvulovic, Milos Qureshi, Moinuddin Loh, Gabriel ; Kim, Hyesoon

University:Georgia Institute of Technology

Department:Electrical and Computer Engineering

关键词: Stacked DRAM;    Die-stacking;    Memory systems;    Heterogeneous memory;    Hardware management;    Computer architecture;   

Others  :  https://smartech.gatech.edu/bitstream/1853/53835/1/SIM-DISSERTATION-2015.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

The main objective of this research is to efficiently enable 3D die-stacked memory and heterogeneous memory systems. 3D die-stacking is an emerging technology that allows for large amounts of in-package high-bandwidth memory storage. Die-stacked memory has the potential to provide extraordinary performance and energy benefits for computing environments, from data-intensive to mobile computing. However, incorporating die-stacked memory into computing environments requires innovations across the system stack from hardware and software. This dissertation presents several architectural innovations to practically deploy die-stacked memory into a variety of computing systems.First, this dissertation proposes using die-stacked DRAM as a hardware-managed cache in a practical and efficient way. The proposed DRAM cache architecture employs two novel techniques: hit-miss speculation and self-balancing dispatch. The proposed techniques virtually eliminate the hardware overhead of maintaining a multi-megabytes SRAM structure, when scaling to gigabytes of stacked DRAM caches, and improve overall memory bandwidth utilization.Second, this dissertation proposes a DRAM cache organization that provides a high level of reliability for die-stacked DRAM caches in a cost-effective manner. The proposed DRAM cache uses error-correcting code (ECCs), strong checksums (CRCs), and dirty data duplication to detect and correct a wide range of stacked DRAM failures—from traditional bit errors to large-scale row, column, bank, and channel failures—within the constraints of commodity, non-ECC DRAM stacks. With only a modest performance degradation compared to a DRAM cache with no ECC support, the proposed organization can correct all single-bit failures, and 99.9993% of all row, column, and bank failures.Third, this dissertation proposes architectural mechanisms to use large, fast, on-chip memory structures as part of memory (PoM) seamlessly through the hardware. The proposed design achieves the performance benefit of on-chip memory caches without sacrificing a large fraction of total memory capacity to serve as a cache. To achieve this, PoM implements the ability to dynamically remap regions of memory based on their access patterns and expected performance benefits.Lastly, this dissertation explores a new usage model for die-stacked DRAM involving a hybrid of caching and virtual memory support. In the common case where system’s physical memory is not over-committed, die-stacked DRAM operates as a cache to provide performance and energy benefits to the system. However, when the workload’s active memory demands exceed the capacity of the physical memory, the proposed scheme dynamically converts the stacked DRAM cache into a fast swap device to avoid the otherwise grievous performance penalty of swapping to disk.