Integration and miniaturization of antennas for system-on-package applications

Design;LCP;Conformal;Material characterization;60 GHz;Multi-beam;Antenna;System-on-package;SOP;Magneto-dielectric;Miniaturization;Integration;WLAN;WiMAX;Flexible antenna;Reactive impedance surface;RIS;LTSA;Slot antenna

Altunyurt, Nevin ; Electrical and Computer Engineering

University:Georgia Institute of Technology

Department:Electrical and Computer Engineering

关键词: Design;    LCP;    Conformal;    Material characterization;    60 GHz;    Multi-beam;    Antenna;    System-on-package;    SOP;    Magneto-dielectric;    Miniaturization;    Integration;    WLAN;    WiMAX;    Flexible antenna;    Reactive impedance surface;    RIS;    LTSA;    Slot antenna;   

Others  :  https://smartech.gatech.edu/bitstream/1853/33903/1/altunyurt_nevin_201005_phd.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

Wireless communications have been an indispensable aspect of everyday life, and there is an increasing consumer demand for accessing several wireless communication technologies from a single, compact, mobile device. System-on-package (SOP) technology is an advanced packaging technology that has been proven to realize the convergence of multiple functions into miniaturized, high-performance systems to meet this demand. With the advancements in the SOP technology, the miniaturization of the front-end module has been achieved using embedded passives in multilayer packages. However, the integration of the antenna directly on the module package is still the barrier to achieve a fully-integrated, high-performance RF SOP system. The main reason for this missing link is that integrating the antenna on the package requires miniaturizing the antenna, which is a difficult task. The focus of this dissertation is to design high-performance antennas along with developing techniques for miniaturization and system-on-package (SOP) integration of these antennas to achieve fully-integrated SOP systems using advanced multilayer organic substrates and thin-film magneto-dielectric materials. The targeted spectrum for the antenna designs are 2.4/5 GHz WLAN/WiMAX and 60 GHz WPAN bands. Several novel antenna designs and configurations to integrate the antenna on the package along with the module are discussed in this dissertation. The advanced polymers used in this research are Liquid Crystalline Polymer (LCP), RXP, and thin-film magneto-dielectrics.