Exploration of liquid crystal polymer packaging techniques for rf wireless systems

Wire bond;Microstrip;BAW;Active antenna;Phased array;Microwave;Millimeter wave;GaAs;CMOS;SiGe;Flip-chip;Liquid crystal polymer;System on package

Patterson, Chad E. ; Electrical and Computer Engineering

University:Georgia Institute of Technology

Department:Electrical and Computer Engineering

关键词: Wire bond;    Microstrip;    BAW;    Active antenna;    Phased array;    Microwave;    Millimeter wave;    GaAs;    CMOS;    SiGe;    Flip-chip;    Liquid crystal polymer;    System on package;   

Others  :  https://smartech.gatech.edu/bitstream/1853/44800/1/patterson_chad_e_201208_phd.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

In the past decade, there has been an increased interest in low-cost, low-power, high data rate wireless systems for both commercial and defense applications. Some of these include air defense systems, remote sensing radars, and communication systems that are used for unmanned aerial vehicles, ground vehicles, and even the individual consumer. All of these applications require state-of-the-art technologies to push the limits on several design factors such as functionality, weight, size, conformity, and performance while remaining cost effective. There are several potential solutions to accomplish these objectives and a highly pursued path is through the utilization of advanced integrated system platforms with high frequency, versatile, multilayered materials.This work intends to explore advanced 3-D integration for state-of the art components in wireless systems using LCP multilayer organic platforms. Several packaging techniques are discussed that utilize the inherent benefits of this material. Wire bond, via interconnect, and flip-chip packages are implemented at RF and millimeter-wave (mm-wave) frequencies to explore the benefits of each in terms of convenience, reliability, cost, and performance. These techniques are then utilized for the demonstration of bulk acoustic waveguide (BAW) filter applications and for the realization of highly integrated phased-array antenna systems.