Contact Material Optimization and Contact Physics in Metal-contact Microelectromechanical Systems (MEMS) Switches

MEMS;failure;field evaporation;material transfer;gold alloy;Switch;microcontact

Yang, Zhenyin ; Donald W. Brenner, Committee Member,Jackie Krim, Committee Member,Ron O. Scattergood, Committee Member,Angus I. Kingon, Committee Chair,Yang, Zhenyin ; Donald W. Brenner ; Committee Member ; Jackie Krim ; Committee Member ; Ron O. Scattergood ; Committee Member ; Angus I. Kingon ; Committee Chair

University:North Carolina State University

关键词: MEMS;    failure;    field evaporation;    material transfer;    gold alloy;    Switch;    microcontact;   

Others  :  https://repository.lib.ncsu.edu/bitstream/handle/1840.16/3851/etd.pdf?sequence=1&isAllowed=y

美国|英语

来源: null

【 摘 要 】

Metal-contact MEMS switches hold great promise for implementing agile radio frequency (RF) systems because of their small size, low fabrication cost, low power consumption, wide operational band, excellent isolation and exceptionally low signal insertion loss. Gold is often utilized as a contact material for metal-contact MEMS switches due to its excellent electrical conductivity and corrosion resistance. However contact wear and stiction are the two major failure modes for these switches due to its material softness and high surface adhesion energy. To strengthen the contact material, pure gold was alloyed with other metal elements. We designed and constructed a new micro-contacting test facility that closely mimic the typical MEMS operation and utilized this facility to efficiently evaluate optimized contact materials. Au-Ni binary alloy system as the candidate contact material for MEMS switches was systematically investigated. A correlation between contact material properties (etc. microstructure, micro-hardness, electrical resistivity, topology, surface structures and composition) and micro-contacting performance was established. It was demonstrated nano-scale graded two-phase Au-Ni film could possibly yield an improved device performance. Gold micro-contact degradation mechanisms were also systematically investigated by running the MEMS switching tests under a wide range of test conditions. According to our quantitative failure analysis, field evaporation could be the dominant failure mode for high-field (> critical threshold field) hot switching; transient thermal-assisted wear could be the dominant failure mode for low-field hot switching; on the other hand, pure mechanical wear and steady current heating ( 1 mA) caused much less contact degradation in cold switching tests. Results from low-force (50 μN⁄ micro-contact), low current (0.1 mA) tests on real MEMS switches indicated that continuous adsorbed films from ambient air could degrade the switch contact resistance.Our work also contributes to the field of general nano-science and technology by resolving the transfer directionality of field evaporation of gold in atomic force microscope (AFM) ⁄scanning tunneling microscope (STM).