Transfer printing based microassembly and colloidal quantum dot film integration

Transfer printing;Microassembly;Micro-Lego;Quantum dot (QD) patterning

Keum, Hohyun

关键词: Transfer printing;    Microassembly;    Micro-Lego;    Quantum dot (QD) patterning;   

Others  :  https://www.ideals.illinois.edu/bitstream/handle/2142/98217/KEUM-DISSERTATION-2017.pdf?sequence=1&isAllowed=y

美国|英语

来源: The Illinois Digital Environment for Access to Learning and Scholarship

【 摘 要 】

Micro / nanoscale manufacturing requires unique approaches to accommodate the immensely different characteristics of the miniscule objects due to their high surface area to volume ratio when compared with macroscale objects. Therefore, surface forces are much more dominating than body forces, which causes the significant difficulty of miniscule object manipulation. Because of this challenge, monolithic microfabrication relying on photolithography has been the primary method to manufacture micro / nanoscale structures and devices in place of microassembly. However, by virtue of the two-dimensional (2D) nature of photolithography, formation of complex 3D shape architectures via monolithic microfabrication is inherently limited, which would otherwise enable improvements in performance and novel functionalities of devices. Furthermore, monolithic microfabrication is compatible only with materials which survive in a wet condition during photolithography. Delicate nanomaterials such as colloidal quantum dots cannot be processed via monolithic microfabrication. In this context, transfer printing has emerged as a method to transfer heterogeneous material pieces from their mother substrates to a foreign substrate utilizing a polymeric stamp in a dry condition. In this thesis, advanced modes of transfer printing are studied and optimized to enable a 3D microassembly called ‘micro-Lego’ and a novel strategy of quantum dot film integration. Micro-Lego involves transfer printing for material piece pick-and-place and thermal joining for irreversible permanent bonding of placed material pieces. A microtip elastomeric stamp is designed to advance transfer printing and thermal joining processes are optimized to ensure subsequent material bonding. The mechanical joining strength between material pieces assembled by micro-Lego are characterized by means of blister tests and the nanoindentation. Moreover, the electrical contact between two conducting materials formed by micro-Lego are examined. Lastly, inspired from the subtractive transfer printing technique, protocols of quantum dot film patterning using polymeric stamps made of a shape memory polymer as well as a photoresist are established for the convenient integration of quantum dots in various geometries and configurations as desired. Transfer printing-based micro / nanoscale manufacturing presented in this thesis opens up new pathways to manufacture not only complex 3D functional micro devices but also high resolution nano devices for unparalleled performance or for an unusual functionality, which are unattainable through monolithic microfabrication.