Residual Stresses In Circular Thin Plates Using Two Dimensional X-ray Diffraction And Finite Element Analysis

Residual Stresses;X-ray Diffraction;Finite Element Analysis;Mechanical Engineering

Alusail, Mohammed

University of Waterloo

关键词: Residual Stresses;    X-ray Diffraction;    Finite Element Analysis;    Mechanical Engineering;   

Others  :  https://uwspace.uwaterloo.ca/bitstream/10012/7562/1/Alusail_%20Mohammed

瑞士|英语

来源: UWSPACE Waterloo Institutional Repository

【 摘 要 】

There are many causes of structural failure. One of the most important factors leading tomaterial failure is residual stress. This stress represents effects left in structures afterprocessing or removal of external loads including changes in shape and crystallite size. Inaggregate, residual stress changes the mechanical behaviour of materials. Variousmeasurement techniques encompassing destructive, semi destructive, and non-destructivetesting can be used to measure residual stresses.Thin plates are common in engineering applications. This thesis analyzes residual stresses oncircular AISI 1020 steel alloy plates after removal of external loads using two-dimensionalX-ray diffraction. Two identical thin circular plates are used in this experiment; one of whichis statically loaded. The other plate is used as a control specimen. Residual stresses in theplates are measured using two-dimensional X-ray diffraction and the measurements arecompared to those obtained using finite element analysis. It was found that experimentallymeasured residual stress occurred due to manufacture processing. Also, modules A and Bshowed the external effect of applying not enough to reach the plastic region to deformspecimen 2 and obtain residual stress results distribution.