Investigations Into High Temperature Components and Packaging.

Marlino, L. D. ; Chinthavali, M. S. ; McCluskey, F. P. ; Seiber, L. E. ; Scudiere, M. B.

Technical Information Center Oak Ridge Tennessee

关键词: Oak Ridge National Laboratory;    Power electronics;    Components;    High temperature;    Packaging;   

RP-ID  :  DE2008921778

学科分类：工程和技术（综合）

美国|英语

来源: National Technical Reports Library

【 摘 要 】

The purpose of this report is to document the work that was performed at the Oak Ridge National Laboratory (ORNL) in support of the development of high temperature power electronics and components with monies remaining from the Semikron High Temperature Inverter Project managed by the National Energy Technology Laboratory (NETL). High temperature electronic components are needed to allow inverters to operate in more extreme operating conditions as required in advanced traction drive applications. The trend to try to eliminate secondary cooling loops and utilize the internal combustion (IC) cooling system, which operates with approximately 105oC water/ethylene glycol coolant at the output of the radiator, is necessary to further reduce vehicle costs and weight. The activity documented in this report includes development and testing of high temperature components, activities in support of high temperature testing, an assessment of several component packaging methods, and how elevated operating temperatures would impact their reliability.