科技报告详细信息
| Thermal Interface Materials for Power Electronics Applications. | |
| Narumanchi, S. ; Mihalic, M. ; Kelly, K. ; Eesley, G. | |
| Technical Information Center Oak Ridge Tennessee | |
| 关键词: Heat transfer; Thermal interface materials; Insulated gate bipolar transistors; Greases; Interfaces; | |
| RP-ID : DE2008935099 | |
| 学科分类：工程和技术（综合） | |
| 美国|英语 | |
| 来源: National Technical Reports Library | |
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【 摘 要 】
The thermal resistance of the thermal interface material layer greatly affects the maximum temperature of the power electronics.
【 预 览 】
| Files | Size | Format | View |
|---|---|---|---|
| DE2008935099.pdf | 596KB |  download |
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