科技报告详细信息
Thermal Interface Materials for Power Electronics Applications. | |
Narumanchi, S. ; Mihalic, M. ; Kelly, K. ; Eesley, G. | |
Technical Information Center Oak Ridge Tennessee | |
关键词: Heat transfer; Thermal interface materials; Insulated gate bipolar transistors; Greases; Interfaces; | |
RP-ID : DE2008935099 | |
学科分类:工程和技术(综合) | |
美国|英语 | |
来源: National Technical Reports Library | |
【 摘 要 】
The thermal resistance of the thermal interface material layer greatly affects the maximum temperature of the power electronics.
【 预 览 】
Files | Size | Format | View |
---|---|---|---|
DE2008935099.pdf | 596KB | download |